We provide tailored electroplating solutions that go beyond meeting specifications to support value creation.
With more than 120 partners, we offer rapid-response process optimization to help customers focus on core production.
We follow a “right first time” approach, supported by AI-based forecasting and digital monitoring to ensure process stability from raw materials to final validation.
We also maintain stringent confidentiality and compliance standards.
We address industry bottlenecks through a dual mechanism combining technical and managerial improvement.
With annual R&D investment of 15%, we have reduced customer defect rates by an average of 12% over the past three years.
We integrate the value chain from R&D to service, supporting green manufacturing through cyanide-free and low-energy technologies.
Our goal is to build a sustainable, high-quality ecosystem for all stakeholders.
We have established three product portfolioses in electroplating and precision surface treatment: high-end electroplating additives, electroless plating solutions and supporting process solutions. Our core technological strengths are outlined below:
Our tin-silver plating additives for semiconductor packaging match the performance of Atotech and MacDermid Alpha while reducing costs by 40%. They are now in mass production.
With five electrochemistry PhDs and a joint laboratory with Shanghai University, we can adapt formulations and processes within 30 days to suit customer production lines.
