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AU-301 Immersion Gold Additive

zdutech — Wed, 06 May 2026 04:47:16 +0000

AU-301 Immersion Gold Additive PCB Product Introduction AU-301 produces a uniform 24k pure gold deposit on nickel surfaces. Wide operating window with high tolerance to contamination; nickel capacity ranges from 0.5 to 1.0g/L. Extended bath life; maintains consistent color and brightness throughout its entireservice life. Heat-resistant gold layer with a fine-grained structure; provides excellent bonding, […]

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PALLADEX PN-200 High-Speed Palladium-Nickel Plating Additive

zdutech — Wed, 06 May 2026 04:44:30 +0000

PALLADEX PN-200 High-Speed Palladium-Nickel Plating Additive PCB Product Introduction Utilizes high-speed electroplating technology specifically designed for palladium-nickel （Pd-Ni） alloy plating on electronic components. Standard deposits contain 80 wt% Palladium, but alloy content is adjustable from 50% to 90% via process control. Stable deposit composition with less than +5% variation within a current density range of […]

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NI-2006HSX Low-Stress Nickel Plating Additive

zdutech — Wed, 06 May 2026 04:41:37 +0000

NI-2006HSX Low-Stress Nickel Plating Additive PCB Product Introduction NI-2006HSX is a Nickel Sulfamate-based plating process. Produces semi-bright nickel deposits with low internal stress and excellent ductility. Particularly suitable as an underlayer for precious and non-precious metal plating. Engineered for high-speed plating equipment using both soluble and insoluble anode systems. Ensures exceptional crystal structure within a […]

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INTECH-2000 Pure Indium Electroplating Additive

zdutech — Wed, 06 May 2026 04:37:09 +0000

INTECH-2000 Pure Indium Electroplating Additive PCB Product Introduction INTECH-2000 is a high-speed, high-efficiency, and highly stable pure indium plating additive. Maintains a consistent plating rate throughout the entire bath life. Produces a uniform matte white deposit across an exceptionally wide range of cathode current densities. Provides an ultra-soft deposit with uniform grain size; the premier […]

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TINTECH-MSA Electro-Tin Plating Additive

zdutech — Wed, 06 May 2026 04:33:47 +0000

TINTECH-MSA Electro-Tin Plating Additive PCB Product Introduction Exceptionally stable process; electrolyte bath can remain viable for several years. Reliable tin deposition performance unaffected by the age of the electrolyte bath. Excellent long-term solderability; survives multiple lead-free reflow assembly cycles. Maintains superior solderability while effectively suppressing tin whiskers. Alternative processes are available to resolve potential solder […]

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T-70RAD Ionic Cleaner for Immersion Tin & Silver

zdutech — Wed, 06 May 2026 03:20:55 +0000

T-70RAD Ionic Cleaner for Immersion Tin & Silver PCB Product Introduction T-70RPT is a water-soluble acidic concentrate designed for post-treatment after immersion tin or electro-tin plating. Provides significant protection against discoloration during high-temperature baking and post-reflow processes. Compatible with both water-based in-line spray rinsing and immersion cleaning systems. Effectively minimizes surface tarnish on tin, especially […]

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T-70RPT Anti-Tarnish Agent for Immersion Tin

zdutech — Wed, 06 May 2026 03:11:41 +0000

T-70RPT Anti-Tarnish Agent for Immersion Tin PCB Product Introduction T-70RPT is a water-soluble acidic concentrate designed for post-treatment after immersion tin or electro-tin plating. Provides significant protection against discoloration during high-temperature baking and post-reflow processes. Compatible with both water-based in-line spray rinsing and immersion cleaning systems. Effectively minimizes surface tarnish on tin, especially after multiple […]

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NIPF-1504 Nickel-Coated Copper (Ni/Cu) Additive (Phosphorus-Free)

zdutech — Sat, 10 Jan 2026 01:00:06 +0000

NIPF-1504 Nickel-Coated Copper (Ni/Cu) Additive (Phosphorus-Free) Solar Product Introduction Produces a semi-bright and uniform nickel alloy deposit. Low internal stress within the deposit. High-temperature resistance with superior solderability and thermal bonding strength on copper. High hardness for enhanced wear resistance. Low-temperature operation with high tolerance to metal contamination, significantly extending bath life. • Versatile application: […]

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TC-688 Pure Tin Electroplating Additive

zdutech — Tue, 23 Dec 2025 08:55:40 +0000

TC-688 Pure Tin Electroplating Additive Solar Product Introduction A single-component, sulfuric acid-based additive system producing a matte pure tin finish. Versatile Anode Compatibility: Supports pure tin blocks, tin bars, or insoluble anodes. Exceptional plating distribution and thickness uniformity. Superior oxidation resistance against Sn2+ ions. High solution stability and extended bath life. Broad operating window for […]

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SC-0505K Powder Dispersant

zdutech — Tue, 23 Dec 2025 08:52:51 +0000

SC-0505K Powder Dispersant Solar Product Advantages Low dosage, cost-effective, and easy to operate. Wide compatibility: Suitable for Copper, Nickel, Aluminum, Silver, and Gold powders. Pre-coating preparation: Thorough water rinsing is required after dispersion before entering the coating solution. Dispersion Mechanism Wetting: Utilizes solvents (water, organic solvents, or surfactants) to wet the particle surface and break […]

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